Creative Electron » Stencil issues: How X-rays can find what’s wrong
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Stencil issues: How X-rays can find what’s wrong

Feb
20

Stencil issues: How X-rays can find what’s wrong

The proper application of solder paste onto a printed circuit board is critical to the success of PCB manufacturing process. Stencils are widely used in SMT applications. In this presentation, we will explore examples of how x-ray inspection can be used to diagnose problems with your stencils.

About the Author:

Dr. Bill Cardoso is the President of Creative Electron. He holds a MS and PhD degrees from the Illinois Institute of Technology (IIT) and an MBA from The University of Chicago. An industry thought leader, Bill has been recognized as IIT's 2011 Outstanding Young Alumnus Awardee for his contributions to science and technology. He is also a Senior member of the Institute of Electrical and Electronics Engineers (IEEE), Surface Mount Technology Association (SMTA), American Physics Society (APS), and the International Society for Optics and Photonics (SPIE). Bill is a holder of several patents in the areas of radiation detection, radiography, and quality inspection.

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