X-Ray Your Process, Not Your Boards
The TruView™ AXI Package is available as an upgrade option to all TruView™ Flex X-Ray Inspection Systems. The TruView™ AXI transforms x-ray inspection into a powerful tool to diagnose and manage your manufacturing process. Powered by statistical analysis tools and gorgeous image quality, the TruView™ AXI option is a key enabler of Statistical Process Control (SPC) - to finally put an end to guesswork.
Goodbye to Reporting: Welcome to Dashboarding
TruView™ AXI introduces real time dashboarding to x-ray inspection. While reporting allows you to manage your business looking back, dashboarding inserts decision making when and where problems are found. Actionable data is the critical weapon in diagnosing issues that cost you money. TruView™ AXI dashboard will be the de facto control panel of your manufacturing process.
BGA Void and Head in Pillow (HIP) Inspection
TruView™ AXI collects data from multiple solder balls in different boards to report the amount of void in each ball. Head and pillow, open, and shorted balls can also be found. Excess voiding can be linked to problems with BGA/PCB planarity, solder selection, solder storage, board cleaning, reflow profile, and flux selection.
QFN & CSP Solder and Void Analysis
QFN and CSP packages can be challenging to assemble and inspect. Statistical analysis of production runs is the only objective way to determine the health of your manufacturing line. TruView™ AXI can find opens, shorts, and voids that are critical to diagnose issues with stencil design, stencil cleaning, reflow profile, solder selection, flux selection, and board cleaning.
LED & Power Electronics Void Measurement
The amount of solder voiding between the LED and the board is critical to the lifespan of the device. Too much voiding blocks the thermal path of the LED, which in turn raises its temperature and exponentially reduces the LED’s lifespan. TruView™ AXI measures this parameter so that you can use voiding as the key metric to manage the health of your manufacturing line.
SMD Inspection for Opens and Shorts
The continuous miniaturization of Surface Mount Devices (SMD) causes a number of problems during assembly of these devices. Opens and shorts are common failure modes that can usually be traced back to printing problems – namely stencil defects. The automated detection of these failure modalities is critical for the continuous assessment of your manufacturing line’s health.
ValueBuilt on a modular and upgradable platform, TruView™ offers the best performance to price ratio.
AlgorithmsCrowdsourced apps and state-of-the-art algorithms offer easy to use solutions to all your x-ray inspection needs.
Safe & ReliableAll TruView™ systems are certified by the relevant authorities and exceed worldwide safety requirements.
Made in USAOur products are proudly designed and meticulously made by our quality-obsessed team in California.