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Upcoming Events

SMTA International 2016 – Register Today!

September 25-28

Booth: 713

Location : Donald Stephens Convention Center, Rosemont, IL

September 26, 1:30PM – 5:00PM

Title: WS18 X-Ray Inspection Applications Tutorial

Course Objectives
In this workshop we will cover the manufacturing of the most challenging surface mount parts to assemble and inspect today: LEDs, BGAs, and QFNs. The workshop will focus on the pitfalls of manufacturing and inspecting PCBs with these devices. Presentations will provide content to solve many of the technical challenges encountered by luminaire integrators and contract manufacturers. This workshop is targeted at manufacturing, process, and quality personnel responsible for designing, implementing and/or controlling the surface mount device application and inspection process. Those personnel responsible for training operators and technicians to perform assembly inspection or control the manufacturing process would also benefit from this workshop.

Topics Covered

  • How LED material handling and storage impact assembly performance
  • LED x-ray inspection: How voids cost you money
  • Case study: How lack of quality killed a successful LED company
  • Process design for BGA and QFN assembly and rework
  • BGA and QFN x-ray inspection: How to see what often goes wrong
  • X-Ray as a tool for quality process design and control

September 27, 2:30PM

Title: INS2 X-ray Inspection of Lead and Lead-free Solder Joints

X-Rays are widely used to inspect solder joints in the electronics industry. As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current x-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials.

In this paper we study how the physics of x-ray requires the change of settings and procedures for an accurate inspection. The atomic number of a material (Z) drives its x-ray absorption. Materials with high Z absorb more x-rays than materials with low Z. Tin (Z = 50), for example, is a common material found in lead-free solders. Lead, on the other hand, has atomic number 82. This difference in atomic numbers – and the different alloys present in the market today – drive the need to change the settings and modes of the x-ray inspection system to match the chemistry of the solder joints. An accurate x-ray technique can only be achieved once the imaging system can produce similar contrast for both lead and lead-free solder inspection.

September 27, 5PM

Title: INS3 Industry Intelligence from Teardowns of IoT and Wearables Devices

The impulse to break a new gadget to “see what’s inside” is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this talk we will cover the teardown of several IoT and wearable devices, from the early Blackberries to the Apple Watch, to understand how the SMT industry has changed. These findings will also help us forecast where we are going as a community by discussing miniaturization and packaging, automation and labor force location, device features, and other important topics. These are key issues we need to address to keep U.S. SMT manufacturing relevant.

SMTA LA/Orange County Expo and Tech Forum

November 3, 2016

Location :  The Grand Event Center, 4101 E Willow St., Long Beach, CA 90815

Time: 1PM

Title: Teardowns of IoT and Wearables Devices

The impulse to break a new gadget to “see what’s inside” is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this talk we will cover the teardown of several IoT and wearable devices, from the early Blackberries to the Apple Watch, to understand how the SMT industry has changed. These findings will also help us forecast where we are going as a community by discussing miniaturization and packaging, automation and labor force location, device features, and other important topics. These are key issues we need to address to keep U.S. SMT manufacturing relevant.