How X-ray Technology is Improving the Electronics Assembly Process

This Thursday, October 18 at 8AM, our COO Griffin Lemaster will present the paper “How X-ray Technology is Improving the Electronics Assembly Process” at the SMTA International Conference in Chicago, IL. Here’re the abstract and slides – don’t miss the live show to ask questions and learn more from the expert in x-ray inspection!

Abstract:

It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this paper we will cover a broad range of applications:

  • Electronic component inspection.
  • Real-time defect verification.
  • Counterfeit detection.
  • Component counting and material management.
  • Reverse engineering.
  • 2D, 2.5D, and 3D x-ray inspection.
  • Voids, bridging, and head-in-pillow failures in bottom terminated components
  • Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
  • Artificial Intelligence

We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way in which we manufacture and inspect anything.