In today’s X-ray University post, we explore how 3D CT imaging improves the inspection of multilayer stacked BGAs (Ball Grid Arrays). As more components stack vertically on PCBs, inspecting these complex assemblies becomes challenging. Fortunately, computed tomography (CT) provides the clarity and detail needed to thoroughly examine each layer of these compact structures.
The Challenges of Multilayer Stacked BGAs
Multilayer stacked BGAs can contain memory, processors, and transceivers, all tightly packed into one module. To connect this module to the PCB, it’s layered with solder balls. However, using 2D X-ray inspection can cause overlapping shadows, making it difficult to view individual connections and identify defects.
How 3D CT Imaging Solves These Problems
With 3D CT imaging, we can isolate and inspect each layer individually, allowing us to separate key areas like the solder balls connecting the module to the PCB. CT provides clear, high-resolution images that reveal details often missed by 2D X-rays. This capability makes it easier to detect issues such as voids, uneven solder, and other connection problems.
CT imaging also allows us to inspect precise connection points with unmatched clarity. By visualizing individual layers, we can identify defects early and address them quickly, ensuring quality and reliability.
Inspecting Solder Quality with 3D CT Imaging
One of the most useful features of CT is its ability to pinpoint the exact locations of voids within solder balls. Unlike traditional X-ray methods, CT imaging offers an unobstructed view of each connection layer. This ensures reliable performance, especially in critical areas.
Upgrade Your BGA Inspections Today
If you’re looking to enhance your inspection capabilities for multilayer BGAs or other complex assemblies, CT imaging provides the precision you need. Contact us today to learn more about CT technology. And don’t forget to follow all of our socials for more insights!
