Creative ElectronGET A DEMO
Bottom Terminated Components

The solder joints on bottom-terminated components such as BGAs and QFNs are largely hidden from even the best microscopes. TruView™ X-ray inspection can see through the component to see the solder pads and voiding hidden beneath it.

Talk To an Engineer Today

Ball Grid Arrays (BGA)| Description

In a high-reliability industry like the medical field, inspection systems designed to test medical devices and components must be precise and accurate down to the smallest measurement. There are lives depending on it. With the TruView™ X-ray Inspection System, inspect terminations under components to verify their connections.

Quad Flat No-lead (QFN)| Description

The TruView™ X-ray inspection system is a either semi or fully automated radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Our proprietary software was designed to easily find shorts and opens in QFN pins, as well as voids on the thermal pad.

Land Grid Array (LGA)| Description

LGAs are challenging to get right. Thus, count on an automated (or semiautomated) TruView™ X-ray inspection system to assess the quality of the solder joints in each pin. Then use our proprietary software to find voids, opens, and shorts in the pins. Another important fail feature in these assemblies is coplanarity, which can be assessed with your TruView™ X-ray system.

Micro Lead Frame (MLF)| Description

The TruView™ X-ray Inspection System is either semi or fully automated radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Our proprietary software was designed to easily find shorts and opens in MLF pins, as well as voids on the thermal pad.

Chip Scale Package (CSP)| Description

CSP is quickly becoming the package of choice for many of the large OEMs. As a result, these small devices are driving the need for higher magnification from your x-ray machine. Fortunately, your TruView™ X-ray systems have kept up with these advancements. State of the art high resolution and high magnification TruView™ X-ray systems are here to enable you to reliably assemble CSP devices.

Light Emitting Diode (LED)| Description

TruView™ X-ray systems have been specially designed to inspect and measure the voids in LED assemblies. These measurements are paramount to build reliable products, since voids in the solder between the LED and the substrate cause the device to run warmer. Since the lifespan of an LED rapidly decreases as its operational temperature increases, voiding in the solder layer is directly associated with the lifespan of your LED assembly.