One of the most reliable ways to connect bare dies to substrates, wire bonds are still the preferred way to package ICs. Use your TruView™ X-ray system to assure you that the wire is properly attached to both sides of the connection. This is the ideal inspection technology to look for lifts, cracks, and breaks.
The development of Package on Package (PoP) technology has been a key enabler to the miniaturization of electronic devices, from medical implantables to smartphones. Your TruView™ X-ray system is more than ever a necessity to identify potential connectivity issues between the multiple layers of vertical integration.