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iPhone XS and XS Max teardowns

iPhone XS and XS Max Teardowns

Every year we head to Australia with our friends from ifixit to teardown the brand new iPhones to figure out how they’re built. The teardowns are done at our dear friends at circuitwise, who let us use their TruView Prime to take the x-ray images you’re used to year after year. For more details please visit the complete teardown here.

iPhone XS Max and iPhone XS devices – after the teardown

We set down with Phil Stoten from Scoop to chat teardowns, x-ray inspection, and the future of electronic packaging. Enjoy!

1).  You have once again provided a virtual teardown for the new iPhoneX with your partners iFixit.  Can you tell me your initial thoughts on the product and is there anything inside that surprised you?

This year we went back to Australia with the ifixit team to tear down the iPhone XS and XS Max. As expected, this new series of devices are spec upgrades of the iPhone X, so there we no major surprises. Apple repeated the stack boards, which greatly increased the complexity of the substrate used and the overall assembly. Perhaps the biggest surprise was the “L” snapped battery of the iPhone XS, the first of its kind in the world of iPhones. The following image shows x-rays of the iPhone X, XS, and XS Max.

X-rays of iPhone X, iPhone XS, and iPhone XS Max

2).  The iPhone is seen as a trailblazer in consumer technology, is it also a trailblazer in terms of manufacturing technology?

The two things come together, you can’t have one without the other. More than being a trailblazer, Apple is a design consolidator. What that means is that prior to Apple’s entrance into a market, device designs are fragmented. Look, for example, at the “smartphone” market prior to the iPhone. We had blackberries, Palm, and many other vendors offering a wide range of designs. After the iPhone, now all devices are a black glass rectangle with a soft keyboard. The same can be said for the tablet market and the iPad, smart watches and the Apple Watch, and for the MacBook.

To be on the edge of design you need to also be on the edge of manufacturing. The iPhone X introduced a semiconductor-like fabrication process for their substrates, which allowed Apple to shrink the whole design by about 35%. The X also introduced a face identification protocol that uses 30,000 infrared dots projected in your face – and imaged by a custom IR camera. These leaps in design push our manufacturing and x-ray inspection capabilities, requiring the supply chain to continuously keep up with Apple.

iPhone XS and iPhone XS Max

3).  What do you think are the main challenges that are faced when squeezing so much technology into a small robust form factor?

The iPhone is perhaps the driver of the inevitable convergence of semiconductor manufacturing and PCB assembly. The future – a not so distant future – will enable phones fully integrated in a single package. We’ll see sensors taking more of the real estate inside our phones, to truly transform them into personal information hubs. Phones will consolidate all our personal data, from shopping lists to movie preferences to our real time EKG.

It’s clear that to accomplish these goals, we’ll need to continue to pack more electronics in smaller spaces. Thus, the x-ray inspection of these devices will continue to be challenge. The need for higher magnification and higher resolution x-ray machines will continue to grow.

X-ray image of iPhone X’s board stack

4).  Are there any new manufacturing techniques that will find their way into the mainstream within the iPhone?

The substrate-like substrate used on the iPhone has already been adopted by all major smartphone makers. It will be interesting to see how long this technology will take to become mainstream in North America. There is a significant retooling required to deal with these substrates, which will require a wave of infrastructure investment.

Substrate like  PCB construction

5).  What should companies in the SMT sector and notably in the inspection arena take away from this teardown?

The constant drive for miniaturization is far from over. The new substrates used in the iPhone X platform opened the door to a new era a electronic packaging that will greatly increase the power of these devices. Furthermore, we have 5G around the corner, which will impose considerable demands in battery – driving the further miniaturization of the electronics. Inspection, specially x-ray systems, need to adapt to higher resolutions and higher magnifications.

HDI evolution towards the modified semi additive process

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