TruView™ Simplex.
Simple
||
Powerful
||
Accessible
||
Affordable

TruView™ Simplex

The TruView™ Simplex provides fast, clear, and reliable imaging for quality control in electronics manufacturing. Designed for SMT, BGA, LED, and semiconductor applications, it allows operators to easily detect hidden defects such as solder voids, bridges, and misalignments without damaging the product. With automated inspection capabilities, intuitive software, and precise multi-angle viewing, it helps manufacturers improve yield, reduce rework, and ensure consistent product quality across production lines.

TruView Simplex PCB SMT and BGA X-ray inspection system

PCB, SMT and BGA X-Ray Inspection for Electronics Manufacturing

The TruView™ Simplex is an electronics X-ray inspection system for PCB and PCBA manufacturing, SMT process control, BGA inspection, LED assemblies, and semiconductor applications. A 90 kV, 5 µm X-ray tube with flat panel detector provides high-resolution nondestructive imaging of hidden solder joints and internal features, while ±30° tilt supports multi-angle inspection. Programmable X/Y routines, automated BGA void and area measurement, and report generation help standardize quality-control workflows from first article inspection through production. Explore our SMT and PCB X-ray inspection solutions for additional electronics inspection options.

Features

  • 90 kV, 5 μm X-ray tube with flat panel detector (FPD)
  • Motorized X/Y stage with Z-axis tube and detector movement, plus ±30° tilt
  • Multi-function DXI image processing software
  • Programmable X/Y inspection routines for automated multi-point inspection
  • Maximum loading area: 420 × 420 mm
  • Maximum inspection area: 380 × 380 mm
  • Up to ~300× system magnification
  • Automatic BGA void and area measurement with report generation

Questions about Simplex?

BGA solder joint X-ray inspection sample

Automated BGA Void Measurement and Multi-Angle Inspection

Simplex combines programmable X/Y inspection routines with motorized X/Y positioning, Z-axis tube and detector movement, and ±30° tilt. Operators can inspect multiple points on a board, view solder joints from different angles, and use automatic BGA void and area measurement with report generation. With a 420 × 420 mm loading area and 380 × 380 mm inspection area, the system is designed for repeatable offline inspection of electronics assemblies without destructive sectioning. Learn more about common BGA defects visible with X-ray inspection.

The X-ray People™

Contact Us

Contact Us

Intended Use

All information is confidential.

Thank You For Your Interest In Our TruView™ X-ray Products

Please describe your application with as much detail as possible. Our X-ray inspection experts will contact you shortly with a quote.

Whether you have $25k for a refurbished system or half a million dollars for a high-end, specialized system, we are here to help.

What You Get

  • A phone call from one of our X-ray inspection experts
  • A brief consultation (complementary sample inspection as needed)
  • Your X-ray inspection system quote

Your Privacy

Your information will not be shared with any 3rd parties under any circumstance.

Financing Available

Need to finance your capital investment? Our finance partners make it easy. Learn more about financing.

From X-Ray University

PCB & SMT X-Ray Inspection Resources

Explore practical resources for PCB, SMT, BGA, solder-joint, magnification, detector, and radiation topics relevant to electronics X-ray inspection workflows.

View All X-Ray University →